Apple has signed a multi-billion dollar, multi-year deal with US-based chipmaker Broadcom. THE the company announced the news on Tuesdaysaying it will continue to work with the chipmaker to develop 5G components and other wireless connectivity items.
Through this collaboration, Broadcom will develop 5G radio frequency components – including FBAR filters – and advanced wireless connectivity components. The FBAR filters will be designed and built in several key US manufacturing and technology centers, including Fort Collins, Colorado, where Broadcom has a major facility.
Apple has already partnered with Broadcom to create Wi-Fi and Bluetooth technologies for its iPhones. However, rumors earlier this year indicated that Apple was working on its own in-house chip to replace Broadcom’s. At the time, a report of Bloomberg suggested it plans to use the new chip in 2025, but it’s unclear how that deal might tie into those plans.
Apple says its multi-year partnership with the company “will enable Broadcom to continue to invest in critical automation projects and in the development of technicians and engineers” and is part of Apple’s effort to invest $430 billion in the states. States over five years. Under the CHIPS and Science Act, the United States will provide $52 billion in grants to companies to build chips in the United States. Apple will start using some of the chips made at TSMC’s Arizona factory as soon as it opens.
“We are excited to make commitments that harness the ingenuity, creativity and spirit of innovation of American manufacturing,” Apple CEO Tim Cook said in a statement. “All of Apple’s products depend on technology designed and built here in the United States, and we will continue to deepen our investments in the American economy because we have unwavering faith in America’s future.”